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Copper (Cu) | 25,4 x 3,2 mm | 99,9%
Weight: 0.00073 kg
Diameter / thickness: Ø 25.4 mm x 3.2 mm
Purity: 99.9%
- Description
- Specification
Description
Copper is one of the most widely used elements in the world and has been used since ancient times. It is reddish-orange in colour, has a melting point of 1,083°C, a density of 8.92 g/cm³ and a vapour pressure of 10-4 Torr at 1,017°C. Two of the world’s most popular alloys, brass and bronze, contain copper. Known as an excellent conductor of heat and electricity, it is found in wires, coins and electromagnets. The vacuum industry relies heavily on copper for the manufacture of carrier plates for sputtering targets. Copper, together with its alloys and compounds, is evaporated under vacuum to form layers in the manufacture of semiconductors, sensors and circuits.
| Material type | Copper |
| Symbol | Cu |
| Atomic weight | 63.546 |
| Atomic number | 29 |
| Colour/appearance | Metallic, copper |
| Thermal conductivity | 400 Watt/m.K |
| Melting point | 1,083 °C |
| Coefficient of thermal expansion | 16.5 x 10-6/K |
| Theoretical density | 8.92 g/cm³ |
| Z-ratio | 0.437 |
| Sputter | DC voltage |
| Max. power density | 200 watts/square inch* |
| Bonding type | Indium, elastomer |
| Remark | Alloyed with W/Ta/Mo.
Smooth and adhesive layers. |
* This is a recommendation based on our experience with these materials in our sputter guns. Rates are based on non-bonded targets and are material specific. Bonded targets should be operated at lower power to avoid bonding failure. Bonded targets should be operated at 20 watts/square inch or less depending on the material.
