032 PRIMS basic MS system

Simply and fully functional sputter deposition unit for reproducible thin film layers applying. Plug & work compact design. 

The process chamber contains 3 ports for magnetron sputtering sources (for metals and inorganics), mounted in a sputter-down configuration. Up to two sources used at the same time (co-deposition) The substrate stage is intended for up to 2-inch diameter samples, with a heating & rotation option.